Brief: Discover the advanced Laser Direct Imaging PCB with Scale Mode File Format, perfect for PCB, HDI, and FPC applications. Featuring a 512W laser power and 620x720mm exposure area, this PCB offers customizable solder mask colors and high precision for reliable performance.
Related Product Features:
Laser Direct Imaging PCB with 512W total power for efficient fabrication.
Effective exposure area of 620x720mm, suitable for various applications.
Customizable solder mask colors including white, black, and yellow.
High accuracy and repeatability with ±12µm alignment precision.
Supports fixed scale, auto scale, interval scale, and partition alignment modes.
Board thickness range of 0.5~3.5mm for versatile use.
Ideal for high-precision PCB, HDI, and FPC applications.
Line width tolerance of ±10% ensures consistent quality.
Pytania:
What is Laser Direct Imaging PCB?
Laser Direct Imaging PCB (LDI) is a technology that uses a laser to directly expose copper foil for high-speed, precise circuit pattern creation, ideal for PCB, HDI, and FPC applications.
What are the key features of the GIS DPX820SM model?
The GIS DPX820SM features a 512W laser power, 620x720mm exposure area, customizable solder mask colors, and ±12µm alignment accuracy, making it perfect for high-precision projects.
Where is the Laser Direct Imaging PCB manufactured?
The Laser Direct Imaging PCB is manufactured by GIS in Suzhou, China, ensuring high-quality production and reliable performance.