Laserowe bezpośrednie obrazowanie PCB z formatem pliku w trybie skalowania do zastosowania PCB HDI FPC

Brief: Discover the advanced Laser Direct Imaging PCB with Scale Mode File Format, perfect for PCB, HDI, and FPC applications. Featuring a 512W laser power and 620x720mm exposure area, this PCB offers customizable solder mask colors and high precision for reliable performance.
Related Product Features:
  • Laser Direct Imaging PCB with 512W total power for efficient fabrication.
  • Effective exposure area of 620x720mm, suitable for various applications.
  • Customizable solder mask colors including white, black, and yellow.
  • High accuracy and repeatability with ±12µm alignment precision.
  • Supports fixed scale, auto scale, interval scale, and partition alignment modes.
  • Board thickness range of 0.5~3.5mm for versatile use.
  • Ideal for high-precision PCB, HDI, and FPC applications.
  • Line width tolerance of ±10% ensures consistent quality.
Pytania:
  • What is Laser Direct Imaging PCB?
    Laser Direct Imaging PCB (LDI) is a technology that uses a laser to directly expose copper foil for high-speed, precise circuit pattern creation, ideal for PCB, HDI, and FPC applications.
  • What are the key features of the GIS DPX820SM model?
    The GIS DPX820SM features a 512W laser power, 620x720mm exposure area, customizable solder mask colors, and ±12µm alignment accuracy, making it perfect for high-precision projects.
  • Where is the Laser Direct Imaging PCB manufactured?
    The Laser Direct Imaging PCB is manufactured by GIS in Suzhou, China, ensuring high-quality production and reliable performance.
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